For through holes in small workpiece thicknesses single pulse processes can be used.
Laser hole drilling machine.
The diameter of these holes can be as small as 0 002 50 μm.
There are four main requirements which high precision drilling with lasers must meet.
If larger holes are required the laser is moved around the circumference of the popped hole until the desired diameter is created.
For thicker materials percussion drilling is first choice and with which the required depth can be achieved by applying several laser pulses.
Time quality flexibility and reproducibility.
Laser drilling is the process of creating thru holes referred to as popped holes or percussion drilled holes by repeatedly pulsing focused laser energy on a material.
For large diameters trepanning drilling a combined drilling cutting process or the multi pass method are used.
Critical items to consider when planning a hole drilling project include the diameter of the hole the thickness of the material the shape of the hole edge quality of hole desired taper of hole and center to center pitch of the holes.
Potomac is continually developing and adding new hole drilling processes to our facility.
The drilling time must be short enough so that laser drilling can compete with conventional drilling methods edm and punching.
The quality requirements are very high for micro drilling in particular.
One of the process in stent manufacturing is hole drilling of the tube holder.
Lasers can be used to drill holes in many different applications across all industries.
Here is a selection of applications done with this technology in both the medical as well as the semicon packaging field.